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Solder paste Inspection - Automated - Inline |
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 The truth is that high complexity PCBs with tiny components is a tendency. To follow such trend, Jet Technology launch JET-6000, a sophisticated and powerful solder paste inspection tester to check all the printing defects. It adopts RGB Tri-linear CCD which incorporated with 3-phases shifting algorithm for 3D profile measurement of solder paste. In addition, SPC reports provide sufficient information for printing process control.
Features
- Meet the most demanding cycle time requirements with 100% inspection
- Precise inspection by 3-phases shifting algorithm for height, area, volume, shift and bridging measurement of solder paste
- Easy and fast to recognize fiducial mark and program by teaching with partial Gerber file
- Easy to analyze defective pads by trend charts and numeric display
- Display overall trend of measurement results with color diagram to be feedback information for optimizing the screen printing.
- Good repeatability and reproducibility (GR&R <10%)
- Accurately inspection of all components with good repeatability for CSP with pads size as small as 8 mils
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In time inspection data of height, area, volume and shrifts of solder paste.
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Statistic Process Control
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Specification
| Dimensions (h x w x d) |
216 x 100 x 137 cm (78 x 39 x 54 in) |
| Machine weight |
1200 kg (2600 lbs) |
| Electric power |
AC 220~240 V, 50/60 Hz, 15 amps. |
| Air pressure |
5 ~ 7 kgf/cm2 (70 ~ 100 psi) |
| Conveyor speed (Left to Right or Right to Left) |
300 mm/sec (12 in/sec) |
| Conveyor height (adjustable) |
890 ~ 965mm (35 ~ 38 in) |
| Maximum inspection area |
500 x 450 mm (15 x 16 in) |
| Minimum inspection area |
100 x 70 mm (4 x 2.75 in) |
| Board thickness range |
0.5 ~ 5.0 mm (0.02 ~ 0.2 in) |
| Board edge clearance |
top 2.5 mm (0.1 in) ,
bottom 3.8 mm (0.2 in) |
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Features
| Typical inspection speeds |
64 cm2/sec (9.94 in2/sec) |
| Typical fiducial mark finding |
< 4 seconds |
| X and Y pixel resolution |
20 microns (0.788 mils) |
| Z axis (height) resolution |
1.225 microns (0.048 mils) |
| Permitted maximum board warp |
< 2mm for each scan width 42 mm |
| Paste height range |
50 ~ 450 micros (2~18 mils) |
| Height Repeatability (3 sigma limit) |
CSP : 5 microns( 8 to 18 mils in diameter)
BGA & QFP : 3 microns( ≧ 20 mils in diameter) |
| Height Repeatability (3 sigma limit) |
CSP : ± 7 %( 8 to 18 mils in diameter)
BGA & QFP : ± 3 %( ≧ 20 mils in diameter) |
| Height Accuracy |
CSP : 8 microns( 8 to 18 mils in diameter)
BGA & QFP : 5 microns( ≧ 20 mils in diameter) |
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Dimension
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