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Home Products Inspection Solutions Solder paste Inspection - Automated - Inline
Solder paste Inspection - Automated - Inline

The truth is that high complexity PCBs with tiny components is a tendency. To follow such trend, Jet Technology launch JET-6000, a sophisticated and powerful solder paste inspection tester to check all the printing defects. It adopts RGB Tri-linear CCD which incorporated with 3-phases shifting algorithm for 3D profile measurement of solder paste. In addition, SPC reports provide sufficient information for printing process control.

Features

  1. Meet the most demanding cycle time requirements with 100% inspection
  2. Precise inspection by 3-phases shifting algorithm for height, area, volume, shift and bridging measurement of solder paste
  3. Easy and fast to recognize fiducial mark and program by teaching with partial Gerber file
  4. Easy to analyze defective pads by trend charts and numeric display
  5. Display overall trend of measurement results with color diagram to be feedback information for optimizing the screen printing.
  6. Good repeatability and reproducibility (GR&R <10%)
  7. Accurately inspection of all components with good repeatability for CSP with pads size as small as 8 mils

In time inspection data of height, area, volume and shrifts of solder paste.
Statistic Process Control

Specification

Dimensions (h x w x d) 216 x 100 x 137 cm (78 x 39 x 54 in)
Machine weight 1200 kg (2600 lbs)
Electric power AC 220~240 V, 50/60 Hz, 15 amps.
Air pressure 5 ~ 7 kgf/cm2 (70 ~ 100 psi)
Conveyor speed (Left to Right or Right to Left) 300 mm/sec (12 in/sec)
Conveyor height (adjustable) 890 ~ 965mm (35 ~ 38 in)
Maximum inspection area 500 x 450 mm (15 x 16 in)
Minimum inspection area 100 x 70 mm (4 x 2.75 in)
Board thickness range 0.5 ~ 5.0 mm (0.02 ~ 0.2 in)
Board edge clearance top 2.5 mm (0.1 in) ,
bottom 3.8 mm (0.2 in)

Features

Typical inspection speeds 64 cm2/sec (9.94 in2/sec)
Typical fiducial mark finding < 4 seconds
X and Y pixel resolution 20 microns (0.788 mils)
Z axis (height) resolution 1.225 microns (0.048 mils)
Permitted maximum board warp < 2mm for each scan width 42 mm
Paste height range 50 ~ 450 micros (2~18 mils)
Height Repeatability (3 sigma limit) CSP : 5 microns( 8 to 18 mils in diameter)
BGA & QFP : 3 microns( ≧ 20 mils in diameter)
Height Repeatability (3 sigma limit) CSP : ± 7 %( 8 to 18 mils in diameter)
BGA & QFP : ± 3 %( ≧ 20 mils in diameter)
Height Accuracy CSP : 8 microns( 8 to 18 mils in diameter)
BGA & QFP : 5 microns( ≧ 20 mils in diameter)

Dimension

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